Design Rule Verification Report

Date	:	10/27/2009
Time	:	1:16:47 PM
Elapsed Time	:	00:00:02
Filename	:	C:\Documents and Settings\MauroS\Desktop\painel_remoto_copia de segurança.PcbDoc

Warnings	:	0
Rule Violations	:	74

Summary

Warnings	Count
Total	0

Rule Violations	Count
SMD Neck-Down Constraint (Percent=50%) (All)	27
Width Constraint (Min=0.354mm) (Max=1.5mm) (Preferred=1mm) (InNet('12V'))	5
Power Plane Connect Rule(Relief Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) (All)	0
Clearance Constraint (Gap=0.2mm) (All),(All)	18
Width Constraint (Min=0.2mm) (Max=1.5mm) (Preferred=0.3mm) (All)	0
Net Antennae (Tolerance=0mm) (All)	0
Minimum Solder Mask Sliver (Gap=0.254mm) (All),(All)	24
Hole To Hole Clearance (Gap=0.254mm) (All),(All)	0
Hole Size Constraint (Min=0.0254mm) (Max=2.54mm) (All)	0
Height Constraint (Min=0mm) (Max=25.4mm) (Prefered=12.7mm) (All)	0
Un-Routed Net Constraint ( (All) )	0
Short-Circuit Constraint (Allowed=No) (All),(All)	0
Total	74

SMD Neck-Down Constraint (Percent=50%) (All)
SMD Neck-Down Constraint Between Pad on MultiLayer And Track on TopLayer
SMD Neck-Down Constraint Between Pad on MultiLayer And Track on TopLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on MultiLayer And Track on TopLayer
SMD Neck-Down Constraint Between Pad on MultiLayer And Track on TopLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on MultiLayer And Track on TopLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on MultiLayer And Track on TopLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer
SMD Neck-Down Constraint Between Pad on BottomLayer And Track on BottomLayer

Width Constraint (Min=0.354mm) (Max=1.5mm) (Preferred=1mm) (InNet('12V'))
Width Constraint: Track (80.772mm,62.23mm)(80.78003mm,62.23mm) Bottom Layer
Width Constraint: Track (107.05302mm,15.494mm)(107.061mm,15.494mm) Bottom Layer
Width Constraint: Track (107.05302mm,16.764mm)(107.061mm,16.764mm) Bottom Layer
Width Constraint: Track (112.268mm,73.1266mm)(112.268mm,73.14402mm) Bottom Layer
Width Constraint: Track (110.998mm,73.1266mm)(110.998mm,73.14402mm) Bottom Layer

Clearance Constraint (Gap=0.2mm) (All),(All)
Track (115.0366mm,74.7522mm)(122.8598mm,74.7522mm) Bottom Layer	Pad H-Bridge T-8(116.078mm,73.14402mm) Bottom Layer
Track (115.0366mm,74.7522mm)(122.8598mm,74.7522mm) Bottom Layer	Pad H-Bridge T-9(117.348mm,73.14402mm) Bottom Layer
Track (115.0366mm,74.7522mm)(122.8598mm,74.7522mm) Bottom Layer	Pad H-Bridge T-10(118.618mm,73.14402mm) Bottom Layer
Pad LEFT motor-1(107.188mm,5.08mm) Multi-Layer	Track (108.5596mm,3.7846mm)(108.5596mm,6.8326mm) Bottom Layer
Pad LEFT motor-1(107.188mm,5.08mm) Multi-Layer	Track (104.648mm,5.08mm)(106.2736mm,3.4544mm) Bottom Layer
Via (83.8454mm,67.4878mm) Top Layer to Bottom Layer	Track (82.69539mm,66.66799mm)(82.69539mm,68.199mm) Bottom Layer
Track (122.8598mm,74.7522mm)(123.2916mm,74.3204mm) Bottom Layer	Track (123.952mm,63.0682mm)(123.952mm,75.0062mm) Bottom Layer
Track (123.2916mm,71.9836mm)(123.2916mm,74.3204mm) Bottom Layer	Track (123.952mm,63.0682mm)(123.952mm,75.0062mm) Bottom Layer
Track (121.92mm,70.612mm)(123.2916mm,71.9836mm) Bottom Layer	Track (123.952mm,63.0682mm)(123.952mm,75.0062mm) Bottom Layer
Pad TAIL motor-5(121.92mm,62.992mm) Multi-Layer	Track (122.5042mm,61.6204mm)(123.952mm,63.0682mm) Bottom Layer
Pad TAIL motor-5(121.92mm,62.992mm) Multi-Layer	Track (120.8024mm,61.6204mm)(122.5042mm,61.6204mm) Bottom Layer
Pad TAIL motor-3(121.92mm,68.072mm) Multi-Layer	Track (120.5484mm,61.8744mm)(120.5484mm,71.7804mm) Bottom Layer
Pad TAIL motor-4(121.92mm,65.532mm) Multi-Layer	Track (120.5484mm,61.8744mm)(120.5484mm,71.7804mm) Bottom Layer
Pad TAIL motor-2(121.92mm,70.612mm) Multi-Layer	Track (120.5484mm,61.8744mm)(120.5484mm,71.7804mm) Bottom Layer
Pad TAIL motor-5(121.92mm,62.992mm) Multi-Layer	Track (120.5484mm,61.8744mm)(120.5484mm,71.7804mm) Bottom Layer
Pad TAIL motor-1(121.92mm,73.152mm) Multi-Layer	Track (122.8598mm,74.7522mm)(123.2916mm,74.3204mm) Bottom Layer
Pad TAIL motor-1(121.92mm,73.152mm) Multi-Layer	Track (123.2916mm,71.9836mm)(123.2916mm,74.3204mm) Bottom Layer
Pad TAIL motor-1(121.92mm,73.152mm) Multi-Layer	Track (121.92mm,70.612mm)(123.2916mm,71.9836mm) Bottom Layer

Minimum Solder Mask Sliver (Gap=0.254mm) (All),(All)
Via (98.00021mm,40.93779mm) Top Layer to Bottom Layer	Pad uC3-15(97.69699mm,43.07398mm) Top Layer
Via (96.8502mm,45.339mm) Top Layer to Bottom Layer	Pad uC3-16(97.047mm,43.07398mm) Top Layer
Via (93.6244mm,41.021mm) Top Layer to Bottom Layer	Pad uC3-20(94.447mm,43.07398mm) Top Layer
Via (93.6244mm,41.021mm) Top Layer to Bottom Layer	Pad uC3-21(93.79702mm,43.07398mm) Top Layer
Via (93.6244mm,41.021mm) Top Layer to Bottom Layer	Pad uC3-22(93.14698mm,43.07398mm) Top Layer
Via (89.897mm,41.0464mm) Top Layer to Bottom Layer	Pad uC3-26(90.54699mm,43.07398mm) Top Layer
Via (89.897mm,41.0464mm) Top Layer to Bottom Layer	Pad uC3-28(89.24701mm,43.07398mm) Top Layer
Via (96.8502mm,45.339mm) Top Layer to Bottom Layer	Pad C21-1(96.904mm,47.244mm) Top Layer
Via (104.7496mm,18.034mm) Top Layer to Bottom Layer	Pad H-Bridge L-3(107.05302mm,18.034mm) Bottom Layer
Via (118.745mm,57.1754mm) Top Layer to Bottom Layer	Pad H-Bridge T-11(118.618mm,59.44403mm) Bottom Layer
Via (95.74698mm,33.782mm) Top Layer to Bottom Layer	Pad C23-1(97.282mm,32.512mm) Multi-Layer
Via (102.80655mm,34.3662mm) Top Layer to Bottom Layer	Pad R02-1(102.108mm,36.068mm) Multi-Layer
Via (61.9506mm,42.2148mm) Top Layer to Bottom Layer	Pad uC1-16(62.738mm,43.942mm) Multi-Layer
Via (39.9288mm,38.0746mm) Top Layer to Bottom Layer	Pad uC1-4(39.878mm,36.322mm) Multi-Layer
Via (51.562mm,22.7584mm) Top Layer to Bottom Layer	Pad uC1 pins-11(50.292mm,21.336mm) Multi-Layer
Via (51.562mm,22.7584mm) Top Layer to Bottom Layer	Pad uC1 pins-12(52.832mm,21.336mm) Multi-Layer
Via (91.313mm,53.594mm) Top Layer to Bottom Layer	Pad uC2 pins-11(91.44mm,51.816mm) Multi-Layer
Via (113.1824mm,50.4444mm) Top Layer to Bottom Layer	Pad uC2 pins-19(111.76mm,51.816mm) Multi-Layer
Via (113.1824mm,50.4444mm) Top Layer to Bottom Layer	Pad uC2 pins-20(114.3mm,51.816mm) Multi-Layer
Via (80.4926mm,2.794mm) Top Layer to Bottom Layer	Pad Servo2-1(78.74mm,1.524mm) Multi-Layer
Via (95.3008mm,40.0304mm) Top Layer to Bottom Layer	Via (93.6244mm,41.021mm) Top Layer to Bottom Layer
Via (91.0336mm,38.6588mm) Top Layer to Bottom Layer	Via (89.154mm,39.1922mm) Top Layer to Bottom Layer
Via (89.897mm,41.0464mm) Top Layer to Bottom Layer	Via (89.154mm,39.1922mm) Top Layer to Bottom Layer
Via (91.1098mm,24.5618mm) Top Layer to Bottom Layer	Via (92.1512mm,23.0124mm) Top Layer to Bottom Layer